Bga or ball grid array is one type of packaging for surface mount technology where smd electronic components are actually mounted or affixed on the surface of the smt printed circuit board. Rework electronics news newspapers books scholar jstor october 2010 learn how and when to remove this template message. Doing it right depends in large part on the skills and knowledge of the rework technician. Most repairing professionals generally start with a starter kit and gradually shift to latest universal kits and stations. Bga reballing isi has an advanced, qualified process for removing and reballing solder spheres that is compatible to the assembly process criteria for any bga package. Micross has developed a proven process for deballingreballing ball grid array bga components to restore them to their original specifications or to bring them up to standards for use in hirel applications. Xool 80 in 1 precision set with magnetic driver kit, professional electronics repair tool kit with portable oxford bag for repair cell phone, iphone, ipad, watch, tablet, pc, macbook. One of those evolutions is the ball grid array or bga. It is an easy, fast, and lowcost technique for bga reballing in volumes ranging from a few to several thousand. Reballing mostly performs on computers, laptops and gaming consoles motherboards and the reason behind this problem is video graphic chip. Sometimes, expecially if they develop high temperatures during normal operations, the tin solder connecting their pins with board pads tend to become unreliable. Practical training course c1bga rework of surface mount ball grid arrays.
Bga reballing kit for mobile phone repairing are needed to repair ball grid array ic on pcb of a mobile phone. Ideally suited for labs and prototyping, the kit contains many items needed to get started literally right out of the box and easily fits into your current processing environment. Bga reballing kit is used for reballing the solder balls of a bga ic ball grid array. Metcal array package rework systems are advanced, versatile machines offering the repeatability, accuracy and thermal control essential for the safe and effective rework of todays leading edge bga, csp, land grip array lga, micro smd, microlead frame mlf and bumped chip component packages. With the utilization of diligent professionals and modern tools for reballing, we have earned respectable position among our clients. The information in this document is for reference only. Chiplevel reparatur, modullevel reparatur, bga tausch, softwareupdates, programmierung, rework, modifikation, testverfahren, analyseverfahren.
The ball grid array gets its name because it is basically an array of metal alloy balls arranged in a grid. The student will have an opportunity to use and evaluate some of the most popular bga rework fixtures on the market to include winslow solderquik preforms, best ez reball, heat direct reballing templates, the universal reballing station, and precision pcb services, inc. This instructable shows how to do a diy rework of bga components, using a hothair gun and commonly available tools. This chapter addresses the surface mount technology smt board assembly process for reflow soldering smt components to boards, as well as rework soldering for removing and replacing individual components on alreadyassembled boards. Most advanced laser reballing process retronix have a top of the line process that sets a benchmark for advanced laser reballing service. Specific control parameters are clearly defined for. This is the original zephyrtronics way of reballing used. After the solder balls are reflowed onto the component the backing material is removed.
Thats why we say that bga rework is mostly science, with a big slice of art thrown in. This is the original zephyrtronics way of reballing. In the deball step, automated sphere removal is performed in a flexline robotic solder dip system which involves a controlled, gentle, multiunit process. The preform is aligned and placed using the rework system pick and place mechanism, and reflowed using the rework nozzle. Reballing with low costhomemade equipement youtube. You can use them with almost any reflow system convection oven or reflow oven, and they work well alongside most rework stations used for component removal and preparation. Semipack offers bga reballing services with speed, reliability and affordability that are unrivalled in the industry the restriction of hazardous substances rohs directive restricts the use of lead in nearly all electronic components used today. Make sure this fits by entering your model number introduction.
Practical training course c1bga advanced rework technology. Reflowing is the process in which the solder on the gpu is reheated until the solder liquidates, allowing it to resettle and form proper bonds with the motherboard. It improves first pass yields and makes the reballing of devices fast and simple. If this long length drill bits donot meet or exceed your expectations. Shop the top 25 most popular bga reballing tools at the best prices. Bga,pga,pop,bqfp,qfn,sot223,plcc,tqfp,tdfn,tsop, pbga,cpga,led chip. Effect of bga reballing and its influence on ball shear strength s. Bga reballing 116 wilbur place 11716 bohemia new york. Bay area quickturn bga rework, bga reballing, pcb printed circuit board repair and fix services for complex and difficult jobs at superb quality. Ideally, position a re balling pan under the stencil. Rework or rework is the term for the refinishing operation or repair of an electronic printed. Oct 25, 2011 reballing with a modified alogen stove for preheating and a hothair station. Rework or rework is the term for the refinishing operation or repair of an electronic printed circuit board pcb assembly, usually involving desoldering and resoldering of surfacemounted electronic components smd. This new reballing station is with automatic centering function, rotating spiral disk.
The atgdp smd bga rework stations feature the latest vision and thermal process control technologies. Our highreliability bga reballing service can quickly rework bga components that require reballing. This system provides reproducible solder bumping technology for packaging optoelectronic devices, mems, sensors, bgas, clccs, csps, flip chips and many more. Procedures for bga rework are welldefined and long established, but there are six common mistakes. Reballing involves dismantling, heating the chip until it can be removed from. These are the typical defects usually leading to the solder balls being replaced. There are several kits and bga rework stations available in the market. These mistakes can be costly leading to the following. The graphics chip is soldered to the board with hundreds small solder balls bga and one or more solder joints crack with time due to the thermal cycle which creates thermal stress contraction. Add in the advent of the rohs and weee directives and rework of the bga is becoming a very exciting topic. Best value bga reballing tools great deals on bga reballing. This process is typically prone to a relatively high defect rate.
Bga rework station t890, bga repair for laptop, bga reball, welding machine technical parameters complete machine power 1500w rated voltage and frequency ac 110230 v 6050hz infrared lamp body power 300 w preheating chassis power 1200 w working bench size 320 x 330 mm infrared lamp body heating size 60 x 60 mm preheating chassis preheating size 245 x 260 mm preheating chassis temperature. Bga reballing services micross ball attach deballing. The bga rework profile is as important as the assembly reflow profile, and in most cases duplicates it. Bga reballing and solder bumping for all types of smds. Bga reballing kit and how to reball bga ic with stencil. Reballing stencils, bga reballing tools, reball bgas. Tinlead sn63pb37 eutectic, lead free, and specialty alloys any ball size and ball pitch including chip scale packages processes are tailored to each part.
Sd 3000ii smt rework station spot hot air systemdigital display and sc 200 smt solder cleaner. The solderquik bga reballing preforms are designed to work well with the equipment and tools you already have. Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hotair gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the. I do bga rework on a daily basis, reflowing, reballing and changing chips on xbox360, ps3 game consoles and notebook motherboards. Therefore, a bga reballing process was introduced as a fall back solution for a. Advanced rework technology ltd presents training courses for all types of soldering and rework for pcbs. At bencor, we have the capability and expertise to accommodate your leading edge pcb assembly requirements with quality bga services we utilize a hakko fr1418 bga rework system that produces realtime temperature graphs.
Dgc media for 2009 presents a new educational series dedicated to interact directly with our customer, these series are dedicated to help you with you procedures. A poorlydeveloped thermal profile can result in damage to the assembly or bga component requiring additional rework cycles to the same site, and damage or reflow of adjacent components. Pbga plastic ball grid array tbga tape ball grid array ubga micro bga ccga ceramic column grid array cbga ceramic ball grid array cpga ceramic pin grid. The solder spheres and any intermetallics are dissolved and flushed away. Therefore, a bga reballing process was introduced as a fall back solution for a scenario in which leadfree components had to be. Accompanies the hacker camp shenzhen 2014 bga workshop video available soon. Aluminium alloy reballing station reball stencil solder ball rework table bn features.
They are great stencils to have for phone repair shop. Our services help in repairing various electronics with maximum perfection within given time frame. Solderquik bga reballing preforms winslow automation. Due to the inherent manual nature of this process, it is time consuming and reproducibility is difficult to ensure. Phonefix msm8953 cpu rework repair reballing stencil template, square rectangle msm8953 cpu series ic repair bga rework reballing stencil template, 0. This bga reballing preform for ultra fine pitch bgas allows you to easily change alloys or reball devices after their removal. Its then replaced back on the motherboard and reflowed to form. Bga reballing services offered by us are well known in the market for producing precise results with utmost accuracy. The system produces 100% yield bga rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including smds, bgas, csps, qfns, flip chips.
Mainly it was made of highquality steel and it can be heated directly by the hot air gun or bga machine to make this soldering. In order to rework remove and replace a bga or, in. Dec 02, 2010 reballing is the process in which the gpu is removed, and the tiny solder balls on the bottom of the graphics card are replaced with a better, leadbased solder. Effect of bga reballing and its influence on ball shear strength. Its only just a normal holding stand who only made for holding chips for reballing. Every bga reballing project is completed to meet ipc and jedec specifications.
Reballing is the process in which the gpu is removed, and the tiny solder balls on the bottom of the graphics card are replaced with a better, leadbased solder. And believe it or not but the video chip of your device is the most unlucky chip who get the most broken soldered joints in it and needs to get repair mostly. As technology continues to advance, more products are being designed with bga, fpga and qfn devices, which all have special rework requirements. Resoldering the components in a process controlled manner and 3. Retronix have installed a top of the line system which will set a benchmark for an advanced and reliable laser reballing service. Bga rework station t890, bga repair for laptop, bga reball, welding machine technical parameters complete machine power 1500w rated voltage and frequency ac 110230 v 6050hz infrared lamp body power 300 w preheating chassis power 1200 w working bench size 320 x 330 mm infrared lamp body heating size 60 x 60 mm preheating chassis preheating size 245 x 260 mm preheating chassis. Bga chip stencils chip stencils is a piece of metal sheet with having lots of holes for solder balls on it. Bga component reballing circuit board rework and repair. Reballing with a modified alogen stove for preheating and a hothair station. Bga reballing services at rs 1500piece computer repair.
Bga removal, reballing, soldering exercise the kit contains almost everything you need to reball your first bga chip. Reballing is most often required when the alloy of the bga component solder balls needs to be changed from leadfree to leaded. At bencor, we have the capability and expertise to accommodate your leading edge pcb assembly requirements with quality bga services. This is my homemade ir rework station during initial testing pulled massive rsx chip from ps3. Based on the historical experiences of most operators, three repair concerns remain paramount. Discover over 3047 of our best selection of bga reballing tools on with topselling bga reballing tools brands. First of all, doing this whole reballing procedure isnt that easy how it looks like, and there are also so many kinds of tools and supplies youll need while reballing a chip. Well, i just figured that this chinese guy may have managed to find a way to coax out a few spare chips from the manufacturer, presumably by posing as a licensed nvidia service company or found an excess supply or something. Effect of bga reballing and its influence on ball shear. When autoplay is enabled, a suggested video will automatically play.
Place chip into re balling pan so that the handles of stencil lay directly above those of the re balling pan as shown at left. Bga reballing procedure 7711 polyimide solder ball stencil. Since rb1 is almighty, it become reduction of the cost. Metcal array package rework systems are advanced, versatile machines offering the repeatability, accuracy and thermal control essential for the safe and effective rework of todays leading edge bga, csp, land grip array lga, micro smd, microlead frame mlf and bumped chip component packages precision placement and powerful software make the rework of. Includes the exact brands and tools used by hacker camp shenzhen to teach bga reballing at a mobile phone repair school. Another nice benefit of the preform for standard rework is the ability to reball the board. Most repairing professionals generally start with a starter kit and gradually shift to latest. Smt pick and place machine ic reballing kit mobile phone bga rework station with inspection camera suitable for different kind of chips.
Excellent for rework down to 0201 and leadfree applications. This is a unique bga reballing preform for ultra fine pitch bgas. Component manufacturers specify no more than 3 reflow cycles for their components, so this laser process enables our customers to meet this requirement. Mass processing techniques are not applicable to single device repair or replacement, and specialized manual techniques by expert personnel using appropriate equipment are. The ball attach and reballing process consists of three steps 1 deball, 2 sphere placement, and 3 reflow.
The kit contains almost everything you need to reball your first bga chip. Phone repair multipurpose bga reballinng stencil template are great stencils to have for phone repair shop. And you know what the saddest part is, all needed tools and supplies arent cheap either and thats why people dont perform this reballing at their home. Gowe automatic bga rework station bga reballing machine. Convection rework system, bga rework okinternational. Gowe automatic bga rework station bga reballing machine with. Component manufacturers specify no more than 3 reflow cycles for their components, so this laser process enables our customers to. Note how well the tack flux holds chip and stencil together. Removing the component off the board without causing damage to the substrate, the lands, and adjacent components during the process, 2. Its then replaced back on the motherboard and reflowed to form proper bonds with the motherboard. Array reballing is typically needed when a bga has been misplaced on the placement line, when solder paste pressure has not been sufficient, or when the pads of the circuit board are oxidized and there is no contact through the solder balls anymore. It is made of aluminum alloy structure, lightweight and durable structure. Without it, you wont achieve a successful and repeatable bga rework process. Smt pick and place machine ic reballing kit mobile phone.
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